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ESD7951ST5G
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra ? Low
Capacitance
The ESD7951 is designed to protect voltage sensitive components that
require ultra ? low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
Specification Features:
? Ultra Low Capacitance 0.5 pF
? Low Clamping Voltage
? Small Body Outline Dimensions:
0.039 ″ x 0.024 ″ (1.00 mm x 0.60 mm)
? Low Body Height: 0.016 ″ (0.4 mm)
? Stand ? off Voltage: 5 V
? Low Leakage
? Response Time is Typically < 1.0 ns
? IEC61000 ? 4 ? 2 Level 4 ESD Protection
? AEC ? Q101 Qualified and PPAP Capable
? This is a Pb ? Free Device
1
http://onsemi.com
PIN 1. CATHODE
2. ANODE
2
1
SOD ? 923
CASE 514AB
MARKING DIAGRAM
1 AA M 2
2
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V ? 0
LEAD FINISH: 100% Matte Sn (Tin)
AA
M
= Specific Device Code
= Date Code
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
Device Package Shipping ?
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ESD7951ST5G
SOD ? 923
(Pb ? Free)
8000/Tape & Reel
IEC 61000 ? 4 ? 2 (ESD) Contact
Air
Total Power Dissipation on FR ? 5 Board
(Note 1) @ T A = 25 ° C
Storage Temperature Range
Junction Temperature Range
Lead Solder Temperature ? Maximum
(10 Second Duration)
° P D °
T stg
T J
T L
± 8
± 15
150
? 55 to +150
? 55 to +125
260
kV
mW
° C
° C
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR ? 5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 2
1
Publication Order Number:
ESD7951S/D
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